■ Move-Free Thin Wafer Mobile E-Chuck Carrier Supporter_4,6,8,12-inch
▲SEMI-AUTO Wafer Bonder of Mobile E-Chuck Carrier Supporter_4,6,8,12-inch
▲FULL-AUTO Wafer Bonder of Mobile E-Chuck Carrier Supporter_4,6,8,12-inch
● Workable in Vacuum Environments
● Be able to adsorb Metal / Semiconductor / Glass / Paper / Porous materials
▲SEMI-AUTO Wafer Bonder of Mobile E-Chuck Carrier Supporter_4,6,8,12-inch
▲FULL-AUTO Wafer Bonder of Mobile E-Chuck Carrier Supporter_4,6,8,12-inch
● Workable in Vacuum Environments
● Be able to adsorb Metal / Semiconductor / Glass / Paper / Porous materials
FULL-AUTO/SEMI-AUTO Bonder of E-Chuck Wafer Carrier Supporter
Patent Coulomb-Force E-Chuck has been developed long time and has dozens of international patents.
Developed by advanced technology to enclose electrical field in the E-Chuck. E-Chuck become as move-free carrier. After adhesion setting, Move-Free Supporter can move freely even disconnecting the power supply. Move-Free support can support hardness or shape reinforcements for thin fragile wafer or glass panel.
Patent Coulomb-Force E-Chuck has best characteristics than many electrostatic chucks under long-term advanced researches and developments. Patent Coulomb-Force E-Chuck is a ideal handling tool for soft and thin materials.
Developed by advanced technology to enclose electrical field in the E-Chuck. E-Chuck become as move-free carrier. After adhesion setting, Move-Free Supporter can move freely even disconnecting the power supply. Move-Free support can support hardness or shape reinforcements for thin fragile wafer or glass panel.
Patent Coulomb-Force E-Chuck has best characteristics than many electrostatic chucks under long-term advanced researches and developments. Patent Coulomb-Force E-Chuck is a ideal handling tool for soft and thin materials.
■ Main Handling Applications
①Thin Wafers, Warp Wafers _4,6,8,12-inch
②PVD, CVD, Plasma ETCHER, ION Beam Trimming (IBT)
③3D IC Fabric Package, MCM, MCP, WLP, FOWLP, WoW, CoW, CoWoS, SoIC
④Flat Glass
⑤Micro-LED
⑥Soft Copper Foil
⑦Soft Film
⑧Vacuum Lamination for OLED or Touch Panel
⑨Shape Reinforcement Carrier (Eg, 4" Wafer-on-6" E-Chuck)
①Thin Wafers, Warp Wafers _4,6,8,12-inch
②PVD, CVD, Plasma ETCHER, ION Beam Trimming (IBT)
③3D IC Fabric Package, MCM, MCP, WLP, FOWLP, WoW, CoW, CoWoS, SoIC
④Flat Glass
⑤Micro-LED
⑥Soft Copper Foil
⑦Soft Film
⑧Vacuum Lamination for OLED or Touch Panel
⑨Shape Reinforcement Carrier (Eg, 4" Wafer-on-6" E-Chuck)
Thin Wafer Handling Solutions
■ Thin Wafer Carrier Supporter
1. Developed by special technology to enclose electrical field in the E-Chuck.
2. Need connect controller for about 30 seconds to switch the adhesion state.
3. After adhesion setting, Cordless Move-Free Supporter can move freely even disconnecting the power supply.
4. Maximum operating temperature: 250 degrees centigrade.
5. Suitable for soft, thin and fragile object carriers. (Eg, thin wafer, thin glass panel, 4"wafer-on-6"chuck Shape Reinforcement Carrier, Wafer Transfer).
1. Developed by special technology to enclose electrical field in the E-Chuck.
2. Need connect controller for about 30 seconds to switch the adhesion state.
3. After adhesion setting, Cordless Move-Free Supporter can move freely even disconnecting the power supply.
4. Maximum operating temperature: 250 degrees centigrade.
5. Suitable for soft, thin and fragile object carriers. (Eg, thin wafer, thin glass panel, 4"wafer-on-6"chuck Shape Reinforcement Carrier, Wafer Transfer).
■ Other Products
①Micro Die Handling 100μm×200μm E-Chuck
②(Coreless Move-Free) Thin Wafer Mobile E-Chuck Carrier_4,6,8,12-inch
▲SEMI-AUTO Wafer Bonder of Mobile E-Chuck Carrier Supporter_4,6,8,12-inch
▲FULL-AUTO Wafer Bonder of Mobile E-Chuck Carrier Supporter_4,6,8,12-inch
③(Wired) Thin Wafer Robot Holder
④(Cordless) Battery Power Holder
⑤Thin Wafer Palm Holder
⑥Anti-wrinkle Foil Holder
⑦2D Curved Holder
⑧3D Curved Holder
⑨AOI Black Holder
⑩Huge Stitching Holder
⑪Other Custom E-Chucks
②(Coreless Move-Free) Thin Wafer Mobile E-Chuck Carrier_4,6,8,12-inch
▲SEMI-AUTO Wafer Bonder of Mobile E-Chuck Carrier Supporter_4,6,8,12-inch
▲FULL-AUTO Wafer Bonder of Mobile E-Chuck Carrier Supporter_4,6,8,12-inch
③(Wired) Thin Wafer Robot Holder
④(Cordless) Battery Power Holder
⑤Thin Wafer Palm Holder
⑥Anti-wrinkle Foil Holder
⑦2D Curved Holder
⑧3D Curved Holder
⑨AOI Black Holder
⑩Huge Stitching Holder
⑪Other Custom E-Chucks
■ Product Videos
Move-Free Wafer Mobile Carrier Supporter
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Move-Free Thin Wafer Mobile Carrier Supporter AutoLoad
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100um Thin Wafer Handling
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FULL-AUTO Wafer Bonder of Mobile E-Chuck Carrier (Options: Clean, Spin Etch, Baking)
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SEMI-AUTO Wafer Bonding of Mobile E-Chuck Carrier Supporter
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SEMI-AUTO Wafer Debonding of Mobile E-Chuck Carrier Supporter
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Thin Wafer Mobile E-Chuck Carrier: 4,6,8,12 inch
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Robot Holder
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Palm Holder
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Thin Warp Wafer Adhered by E-chuck
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Contact E-mail : [email protected]
Phone : +886 (0)-3-5824192, +886 (0)-915-669-072 (LINE, WhatsApp), WeChat: edragon168
Copyright 2014 of EDRAGON TECHNOLOGY CORPORATION
Phone : +886 (0)-3-5824192, +886 (0)-915-669-072 (LINE, WhatsApp), WeChat: edragon168
Copyright 2014 of EDRAGON TECHNOLOGY CORPORATION