■ Patent Coulomb-Force E-Chuck (Electrostatic Chuck)
● Workable in Vacuum Environments
● Be able to adsorb Metal / Semiconductor / Glass / Paper / Porous materials
● Workable in Vacuum Environments
● Be able to adsorb Metal / Semiconductor / Glass / Paper / Porous materials
Thin Warp Wafer Adhered by E-chuck
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■ Main Handling Applications
①Thin Wafers, Warp Wafers _4,6,8,12-inch
②PVD, CVD, Plasma ETCHER, ION Beam Trimming (IBT)
③3D IC Fabric Package, MCM, MCP, WLP, FOWLP, WoW, CoW, CoWoS, SoIC
④Flat Glass
⑤Micro-LED
⑥Soft Copper Foil
⑦Soft Film
⑧Vacuum Lamination for OLED or Touch Panel
⑨Shape Reinforcement Carrier (Eg, 4" Wafer-on-6" E-Chuck)
①Thin Wafers, Warp Wafers _4,6,8,12-inch
②PVD, CVD, Plasma ETCHER, ION Beam Trimming (IBT)
③3D IC Fabric Package, MCM, MCP, WLP, FOWLP, WoW, CoW, CoWoS, SoIC
④Flat Glass
⑤Micro-LED
⑥Soft Copper Foil
⑦Soft Film
⑧Vacuum Lamination for OLED or Touch Panel
⑨Shape Reinforcement Carrier (Eg, 4" Wafer-on-6" E-Chuck)
Thin Wafer Handling Solutions
FULL-AUTO/SEMI-AUTO Bonder of E-Chuck Wafer Carrier Supporter
Patent Coulomb-Force E-Chuck has been developed long time and has dozens of international patents.
Advanced technology enclose electrical field in the E-Chuck. E-Chuck become a move-free carrier. After adhesion setting, Move-Free Supporter can disconnect the power supply and still keep adhesion force. Move-Free support can support hardness or shape reinforcements for thin fragile wafer or glass panel.
Patent Coulomb-Force E-Chuck has best characteristics than many electrostatic chucks under long-term advanced researches and developments. Patent Coulomb-Force E-Chuck is a ideal handling tool for soft and thin materials.
Advanced technology enclose electrical field in the E-Chuck. E-Chuck become a move-free carrier. After adhesion setting, Move-Free Supporter can disconnect the power supply and still keep adhesion force. Move-Free support can support hardness or shape reinforcements for thin fragile wafer or glass panel.
Patent Coulomb-Force E-Chuck has best characteristics than many electrostatic chucks under long-term advanced researches and developments. Patent Coulomb-Force E-Chuck is a ideal handling tool for soft and thin materials.
■ Adhere Various Materials
(1) Metal conductor (e.g., copper foil)
(2) Semiconductors (e.g., silicon, GaAs)
(3) Insulators (e.g., paper, glass panel)
(4) Porous objects.
(5) The adsorption force per unit area is related to the adsorption material and the contact surface smoothness.
(6) Material ranking of the adsorption force per unit area is : Metal > Semiconductors > Insulator.
■ Operational Environments
(1) Atmospheric Pressure.
(2) Vacuum Environment.
(1) Metal conductor (e.g., copper foil)
(2) Semiconductors (e.g., silicon, GaAs)
(3) Insulators (e.g., paper, glass panel)
(4) Porous objects.
(5) The adsorption force per unit area is related to the adsorption material and the contact surface smoothness.
(6) Material ranking of the adsorption force per unit area is : Metal > Semiconductors > Insulator.
■ Operational Environments
(1) Atmospheric Pressure.
(2) Vacuum Environment.
■ Product Features
(1) Coulomb-Force Electrostatic Chuck.
(2) Patent Coulomb-Force E-Chuck was developed long time and has dozens of international patents.
(3) Stable and uniform adhesion force is achieved by applying the voltage to the electrode
(4) Apply lowest voltage to keep maximum adhesion force.
(5) Because voltage potential of object backside is zero, adhesion will not affect the backside circuits.
(6) Be able to adhere various materials : metal / semiconductor / glass / paper / porous materials.
(7) Work normally in a vacuum environments and general atmospheric environments.
(8) Can define adhesion area and non-adhesion area. Non-adhesion area can define other functions.
(9) Can be made by different substrates. Such as stainless, aluminum, ceramic, semiconductor wafer or glass.
(10) Can be customized into various sizes and thicknesses for customer's applications.
(11) Advanced technology enclose electrical field in the E-Chuck. E-Chuck become as move-free carrier.
(12) After adhesion setting, Move-Free Supporter can move freely even disconnecting the power supply. Move-Free support can support hardness or shape reinforcements for thin wafer or glass panel.
(1) Coulomb-Force Electrostatic Chuck.
(2) Patent Coulomb-Force E-Chuck was developed long time and has dozens of international patents.
(3) Stable and uniform adhesion force is achieved by applying the voltage to the electrode
(4) Apply lowest voltage to keep maximum adhesion force.
(5) Because voltage potential of object backside is zero, adhesion will not affect the backside circuits.
(6) Be able to adhere various materials : metal / semiconductor / glass / paper / porous materials.
(7) Work normally in a vacuum environments and general atmospheric environments.
(8) Can define adhesion area and non-adhesion area. Non-adhesion area can define other functions.
(9) Can be made by different substrates. Such as stainless, aluminum, ceramic, semiconductor wafer or glass.
(10) Can be customized into various sizes and thicknesses for customer's applications.
(11) Advanced technology enclose electrical field in the E-Chuck. E-Chuck become as move-free carrier.
(12) After adhesion setting, Move-Free Supporter can move freely even disconnecting the power supply. Move-Free support can support hardness or shape reinforcements for thin wafer or glass panel.
■ Comparisons with other products
■ Main Products
①Micro Die Handling 100μm×200μm E-Chuck
②(Move-Free) Thin Wafer Mobile E-Chuck Carrier Supporter
▲SEMI-AUTO Wafer Bonder of Mobile E-Chuck Carrier Supporter
▲FULL-AUTO Wafer Bonder of Mobile E-Chuck Carrier Supporter
1. General Power Input 110V/220V
2. Be able to keep adhesion without power source connection and Move Freely.
3. Need put on controller platform for about 30 seconds to switch the adhesion state.
4. After adhesion setting, supporter can move freely and keep adhesion, even disconnecting power.
5. Maximum operating temperature: 200 degrees centigrade.
6. Suitable for soft, thin and fragile object carriers. (Eg, thin wafer, thin glass panel, 4"wafer-on-6"chuck Shape Carrier).
③(Wired) Thin Wafer Robot Holder
1. General Power Input 12V
2. Real time power switch by controller to set adsorption or release.
3. Maximum operating temperature: 200 degrees centigrade (E-Chuck surface).
4. Suitable for automation equipments. (Eg, curved glass, borderless screen, OLED vacuum Lamination.)
④(Cordless) Battery Power Holder
1. Battery power
2. Could be charged by general power
3. Easily to move and handle objects
4. Be able to be vehicles between manufacturing machines
■ Custom Products
⑤Thin Wafer Palm Holder
⑥Anti-wrinkle Foil Holder
⑦2D Curved Holder
⑧3D Curved Holder
⑨AOI Holder (Black)
⑩Huge Stitching Holder
⑪Other Custom E-Chucks
①Micro Die Handling 100μm×200μm E-Chuck
②(Move-Free) Thin Wafer Mobile E-Chuck Carrier Supporter
▲SEMI-AUTO Wafer Bonder of Mobile E-Chuck Carrier Supporter
▲FULL-AUTO Wafer Bonder of Mobile E-Chuck Carrier Supporter
1. General Power Input 110V/220V
2. Be able to keep adhesion without power source connection and Move Freely.
3. Need put on controller platform for about 30 seconds to switch the adhesion state.
4. After adhesion setting, supporter can move freely and keep adhesion, even disconnecting power.
5. Maximum operating temperature: 200 degrees centigrade.
6. Suitable for soft, thin and fragile object carriers. (Eg, thin wafer, thin glass panel, 4"wafer-on-6"chuck Shape Carrier).
③(Wired) Thin Wafer Robot Holder
1. General Power Input 12V
2. Real time power switch by controller to set adsorption or release.
3. Maximum operating temperature: 200 degrees centigrade (E-Chuck surface).
4. Suitable for automation equipments. (Eg, curved glass, borderless screen, OLED vacuum Lamination.)
④(Cordless) Battery Power Holder
1. Battery power
2. Could be charged by general power
3. Easily to move and handle objects
4. Be able to be vehicles between manufacturing machines
■ Custom Products
⑤Thin Wafer Palm Holder
⑥Anti-wrinkle Foil Holder
⑦2D Curved Holder
⑧3D Curved Holder
⑨AOI Holder (Black)
⑩Huge Stitching Holder
⑪Other Custom E-Chucks
■ Demonstration Video
Adhere Various Materials
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(Wired) Robot Holder
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(Move-Free) Thin Wafer Mobile Carrier Supporter
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(Cordless) Palm Holder
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Foil Holder
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(Cordless) Palm Holder : 100um Thin Wafer Handling
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Micro Die Handling 100μm×200μm E-Chuck
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Thin Wafer Carrier: 4,6,8,12 inch
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[Semiconductor] FULL-AUTO Wafer Bond/Debond of E-Chuck Carrier (Options: Clean, Spin Etch, Baking)
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[Semiconductor] SEMI-AUTO Wafer Bond of E-Chuck Carrier Supporter
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[Semiconductor] SEMI-AUTO Wafer Debond of E-Chuck Carrier Supporter
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■ Related Articles
Contact E-mail : [email protected]
Phone : +886 (0)-3-5824192, +886 (0)-915-669-072 (LINE, WhatsApp), WeChat: edragon168
Copyright 2014 of EDRAGON TECHNOLOGY CORPORATION
Phone : +886 (0)-3-5824192, +886 (0)-915-669-072 (LINE, WhatsApp), WeChat: edragon168
Copyright 2014 of EDRAGON TECHNOLOGY CORPORATION