■ What is Electrostatic Chuck ?
Adhere a variety of materials
Thin Warp Wafer Adhered by E-chuck
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■ Definition of Electrostatic Chuck
The electrostatic chuck is a device for generating an attracting force between an electrode and an object at a voltage applied to the electrode.
■ Varieties of Electrostatic Chuck
(1) Coulomb-Fore Electrostatic Chuck
(2) Johnsen-Rahbek Electrostatic Chuck, or JR Electrostatic Chuck
■ Advantages of Coulomb-force Electrostatic Chuck
(1) Adsorbing various objects such as:metal conductor, semiconductor, insulator (glass), and porous materials.
(2) Working well in vacuum environment.
(3) Never affect on the backside of the object, for example TFT circuit, because electric field does not reach it. Avoid traditional electrostatic side-effect.
(4) Not folder, it’s to use adsorption. The object surface of the uniform force, the object does not produce indentation, scars and so on.
(5) Can support thin thickness of the wafer and re-bending wafer. After adsorption, can enter the processing program.
The electrostatic chuck is a device for generating an attracting force between an electrode and an object at a voltage applied to the electrode.
■ Varieties of Electrostatic Chuck
(1) Coulomb-Fore Electrostatic Chuck
(2) Johnsen-Rahbek Electrostatic Chuck, or JR Electrostatic Chuck
■ Advantages of Coulomb-force Electrostatic Chuck
(1) Adsorbing various objects such as:metal conductor, semiconductor, insulator (glass), and porous materials.
(2) Working well in vacuum environment.
(3) Never affect on the backside of the object, for example TFT circuit, because electric field does not reach it. Avoid traditional electrostatic side-effect.
(4) Not folder, it’s to use adsorption. The object surface of the uniform force, the object does not produce indentation, scars and so on.
(5) Can support thin thickness of the wafer and re-bending wafer. After adsorption, can enter the processing program.
■ Product Items of Patent Coulomb-Force E-Chuck
FULL-AUTO/SEMI-AUTO Bonder of E-Chuck Wafer Carrier Supporter
■ Main Handling Applications
①Thin Wafers, Warp Wafers _4,6,8,12-inch
②PVD, CVD, Plasma ETCHER, ION Beam Trimming (IBT)
③3D IC Fabric Package, MCM, MCP, WLP, FOWLP, WoW, CoW, CoWoS, SoIC
④Flat Glass
⑤Micro-LED
⑥Soft Copper Foil
⑦Soft Film
⑧Vacuum Lamination for OLED or Touch Panel
⑨Shape Reinforcement Carrier (Eg, 4" Wafer-on-6" E-Chuck)
①Thin Wafers, Warp Wafers _4,6,8,12-inch
②PVD, CVD, Plasma ETCHER, ION Beam Trimming (IBT)
③3D IC Fabric Package, MCM, MCP, WLP, FOWLP, WoW, CoW, CoWoS, SoIC
④Flat Glass
⑤Micro-LED
⑥Soft Copper Foil
⑦Soft Film
⑧Vacuum Lamination for OLED or Touch Panel
⑨Shape Reinforcement Carrier (Eg, 4" Wafer-on-6" E-Chuck)
Thin Wafer Handling Solutions
■ Main Products
①Micro Die Handling 100μm×200μm E-Chuck
②(Coreless Move-Free) Thin Wafer Mobile E-Chuck Carrier_4,6,8,12-inch
▲SEMI-AUTO Wafer Bonder of Mobile E-Chuck Carrier Supporter_4,6,8,12-inch
▲FULL-AUTO Wafer Bonder of Mobile E-Chuck Carrier Supporter_4,6,8,12-inch
③(Wired) Thin Wafer Robot Holder
④(Cordless) Battery Power Holder
⑤Thin Wafer Palm Holder
⑥Anti-wrinkle Foil Holder
⑦2D Curved Holder
⑧3D Curved Holder
⑨AOI Black Holder
⑩Huge Stitching Holder
⑪Other Custom E-Chucks
①Micro Die Handling 100μm×200μm E-Chuck
②(Coreless Move-Free) Thin Wafer Mobile E-Chuck Carrier_4,6,8,12-inch
▲SEMI-AUTO Wafer Bonder of Mobile E-Chuck Carrier Supporter_4,6,8,12-inch
▲FULL-AUTO Wafer Bonder of Mobile E-Chuck Carrier Supporter_4,6,8,12-inch
③(Wired) Thin Wafer Robot Holder
④(Cordless) Battery Power Holder
⑤Thin Wafer Palm Holder
⑥Anti-wrinkle Foil Holder
⑦2D Curved Holder
⑧3D Curved Holder
⑨AOI Black Holder
⑩Huge Stitching Holder
⑪Other Custom E-Chucks
■ Features of Patent Coulomb-Force E-Chuck
(1) Coulomb-Force Electrostatic Chuck.
(2) Patent Coulomb-Force E-Chuck was developed long time and has dozens of international patents.
(3) Stable and uniform adhesion force is achieved by applying the voltage to the electrode
(4) Apply lowest voltage to keep maximum adhesion force.
(5) Because voltage potential of object backside is zero, adhesion will not affect the backside circuits.
(6) Be able to adhere various materials : metal / semiconductor / glass / paper / porous materials.
(7) Work normally in a vacuum environments and general atmospheric environments.
(8) Cab define adhesion area and non-adhesion area. Non-adhesion area can define other functions.
(9) Can be made by different substrates. Such as stainless, aluminum, ceramic, semiconductor wafer or glass.
(10) Can be customized into various sizes and thicknesses for customer's applications.
(11) Advanced technology enclose electrical field in the E-Chuck. E-Chuck become as move-free carrier.
(12) After adhesion setting, Move-Free Supporter can move freely even disconnecting the power supply. Move-Free support can support hardness or shape reinforcements for thin wafer or glass panel.
(1) Coulomb-Force Electrostatic Chuck.
(2) Patent Coulomb-Force E-Chuck was developed long time and has dozens of international patents.
(3) Stable and uniform adhesion force is achieved by applying the voltage to the electrode
(4) Apply lowest voltage to keep maximum adhesion force.
(5) Because voltage potential of object backside is zero, adhesion will not affect the backside circuits.
(6) Be able to adhere various materials : metal / semiconductor / glass / paper / porous materials.
(7) Work normally in a vacuum environments and general atmospheric environments.
(8) Cab define adhesion area and non-adhesion area. Non-adhesion area can define other functions.
(9) Can be made by different substrates. Such as stainless, aluminum, ceramic, semiconductor wafer or glass.
(10) Can be customized into various sizes and thicknesses for customer's applications.
(11) Advanced technology enclose electrical field in the E-Chuck. E-Chuck become as move-free carrier.
(12) After adhesion setting, Move-Free Supporter can move freely even disconnecting the power supply. Move-Free support can support hardness or shape reinforcements for thin wafer or glass panel.
■ Principle of Patent Coulomb-Force E-Chuck
Patent Coulomb-Force E-Chuck has been developed long time and has dozens of international patents.
Advanced technology enclose electrical field in the E-Chuck. E-Chuck become a move-free carrier. After adhesion setting, Move-Free Supporter can disconnect the power supply and still keep adhesion force. Move-Free support can support hardness or shape reinforcements for thin fragile wafer or glass panel.
Patent Coulomb-Force E-Chuck has best characteristics than many electrostatic chucks under long-term advanced researches and developments. Patent Coulomb-Force E-Chuck is a ideal handling tool for soft and thin materials.
Patent Coulomb-Force E-Chuck has been developed long time and has dozens of international patents.
Advanced technology enclose electrical field in the E-Chuck. E-Chuck become a move-free carrier. After adhesion setting, Move-Free Supporter can disconnect the power supply and still keep adhesion force. Move-Free support can support hardness or shape reinforcements for thin fragile wafer or glass panel.
Patent Coulomb-Force E-Chuck has best characteristics than many electrostatic chucks under long-term advanced researches and developments. Patent Coulomb-Force E-Chuck is a ideal handling tool for soft and thin materials.
(1) Applied voltage to electrodes
(2) Surface polarization occurs on object’s attractive surface
(3) Attractive force between electrode and object
(4) No voltage potential on rear surface of object
(5) object:conductor ~semi-conductor~insulator
(2) Surface polarization occurs on object’s attractive surface
(3) Attractive force between electrode and object
(4) No voltage potential on rear surface of object
(5) object:conductor ~semi-conductor~insulator
■ Comparisons with other products:
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Contact E-mail : [email protected]
Phone : +886 (0)-3-5824192, +886 (0)-915-669-072 (LINE, WhatsApp), WeChat: edragon168
Copyright 2014 of EDRAGON TECHNOLOGY CORPORATION
Phone : +886 (0)-3-5824192, +886 (0)-915-669-072 (LINE, WhatsApp), WeChat: edragon168
Copyright 2014 of EDRAGON TECHNOLOGY CORPORATION