Patent Coulomb-Force E-Chuck has been developed long time and has dozens of international patents. Advanced technology enclose electrical field in the E-Chuck. E-Chuck become a move-free carrier. After adhesion setting, Move-Free Supporter can disconnect the power supply and still keep adhesion force. Move-Free support can support hardness or shape reinforcements for thin wafer or glass panel. Patent Coulomb-Force E-Chuck has best characteristics than many electrostatic chucks under long-term advanced researches and developments. Patent Coulomb-Force E-Chuck is a ideal handling tool for soft and thin materials. ■ Definition of Electrostatic Chuck The electrostatic chuck is a device for generating an attracting force between an electrode and an object at a voltage applied to the electrode. ■ Varieties of Electrostatic Chuck (1) Coulomb-Fore Electrostatic Chuck (2) Johnsen-Rahbek Electrostatic Chuck, or JR Electrostatic Chuck ■Advantages of Coulomb-force Electrostatic Chuck (1) Adsorbing various objects such as:metal conductor, semiconductor, insulator (glass), and porous materials. (2) Working well in vacuum environment. (3) Never affect on the backside of the object, for example TFT circuit, because electric field does not reach it. Avoid traditional electrostatic side-effect. (4) Not folder, it’s to use adsorption. The object surface of the uniform force, the object does not produce indentation, scars and so on. (5) Can support thin thickness of the wafer and re-bending wafer. After adsorption, can enter the processing program. ■ Adsorbable Material (1) Metal conductor (e.g., copper foil) (2) Semiconductors (e.g., silicon, GaAs) (3) Insulators (e.g., paper, glass substrate) (4) Porous objects. (5) The adsorption force per unit area is related to the adsorption material and the contact surface smoothness. (6) Material ranking of the adsorption force per unit area is : Metal > Semiconductors > Insulator. ■ Operational Environment (1) Atmospheric Pressure. (2) Vacuum Environment. Special Product Characteristics : (1) can adhere various kind of materials, such as metal / semiconductor wafer / glass panel / thin film / paper. (2) can work well in atmosphere and vacuum environment (3) can keep adhesion with no power connection (4) can be customized to various shape adhere various kind of materials, such as metal / semiconductor wafer / glass panel / thin film / paper. keep adhesion with no power connection ■ Main Products : ① Stage Holder, ② Supporter, ③ Palm, ④ Custom ① Wired Stage Holder: 1. Suitable for automation equipment. (Eg, curved glass, borderless screen, vacuum press.) 2. At any time with the power switch, adsorption or release. 3. Maximum operating temperature: maximum operating temperature of 200 degrees C (chuck surface). ② (Move-Free) Thin Wafer Supporter: 1. Carriers for soft and thin objects. (Eg, thin silicon wafer, 4"-on-6" Shape Reinforcement Carrier). 2. Can be in the absence of power to contact the situation, to retain the original adsorption state. 3. Need to connect the controller for about 30 seconds to switch the adsorption state. 4. Maximum operating temperature: the maximum operating temperature of 250 degrees C. ③ Cordless Palm: 1. Suitable for absorbing thin and short objects. (Eg, 12 "wafers, 3" flat glass.) 2. Use a rechargeable battery for easy portability. ④ Other Custom E-Chuck: 1. Cordless Holder Patent Cordless Holder (built-in battery-driven, no plug, suitable for conveying thin-chip) 2. Patented Electric Belt (One of the objects to be accumulated at the top of the stack) (Example: Printer.) 3. Anti-wrinkle sucker (for example: soft copper foil.) ■ Comparisons with other products: ■ Main Handling Applications (1) Big-Size Flat Panel (2) Big-Size Wafer Moving (3) Semiconductor BGBM Thin Wafer (4) Warp Wafer (5) Move-Free Shape Reinforcement (6) Cupper Foil (7) Soft Film (8) Curved Glass (9) Vacuum Lamination in OLED, Touch Panel (10) Vacuum deposition ■ Features of Patent Coulomb-Force E-Chuck (1) Coulomb-Force Electrostatic Chuck. (2) Patent Coulomb-Force E-Chuck was developed long time and has dozens of international patents. (3) Stable and uniform adsorption force is achieved by applying the voltage to the electrode (4) Apply lowest voltage to keep maximum adhesion force. (5) Because voltage potential of object backside is zero, adhesion will not affect the backside circuits. (6) Be able to adhere various materials : metal / semiconductor / glass / paper / porous materials. (7) Work normally in a vacuum environments and general atmospheric environments. (8) Cab define adsorption area and non-adsorption area. Non-adsorption area can define other functions. (9) Can be made by different substrates. Such as stainless, aluminum, ceramic, semiconductor wafer or glass. (10) Can be customized into various sizes and thicknesses for customer's applications. (11) Developed by advanced technology to enclose electrical field. E-Chuck become as move-free carrier. (12) After adhesion setting, Move-Free Supporter can move freely even disconnecting the power supply. Move-Free support can support hardness or shape reinforcements for thin warpage wafer or glass panel. What is the Cordless E-Chuck? The E-Chuck is a tool that clamps an object with the force generated between the electrode and the object by applying a voltage to the electrode. There are two different types of electrostatic clamping methods. One is Coulomb force type that utilizes an insulator as a dielectric material, and the other is Johnson-Rahbek force type that utilizes an attractive force induced by dielectric polarization caused by minute electric current flow across the boundary between an object and a dielectric material. Differences from the other E-Chucks Our electrostatic chucks utilize Coulomb force. It can realize stable clamping force generated by an opposite charges on an object surface induced by applying a voltage to the electrode. HPTS, which is an E-Chuck, demonstrates the strongest clamping force under the lowest voltage in E-chucks utilizing Coulomb force. HPTS can generate stable force when the object is an insulator that is known to be difficult to clamp. Moreover, HPTS never affects on the backside of the object, for example TFT circuit, because electric field does not reach it. The merits of HPTS (Hyper Pure Transfer System) 1. Best for clamping thin works because it can apply uniform force to the whole object 2. Clamp various objects such as conductors, semiconductors, insulators and blank glass substrates 3. Never affect on the backside of the object, for example TFT circuit, because electric field does not reach it. 4. Clamp objects with porosity. 5. Give no surface imprints, cracks and transfers of porosity to objects 6. Clamp only one object of the top from a pile of objects 7. Generate a stable clamping force in vacuum environments 8. Generate stronger clamping force under lower voltage than conventional E-chucks *end
4 Comments
steven
5/23/2017 17:39:41
You are welcome.
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huynh
8/23/2019 15:35:00
I am researching this project ,can you give me for manual file of the hyper pure transfer system .Thanks
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